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TFBS4650
Vishay Semiconductors
Infrared Transceiver 9.6 kbit/s to 115.2 kbit/s (SIR)
Description
The TFBS4650 is one of the smallest IrDA(R) compliant transceivers available. It supports data rates up to 115 kbit/s. The transceiver consists of a PIN photodiode, infrared emitter, and control IC in a single package.
20206
Features
* Compliant with the IrDA physical layer IrPHY 1.4 (low power specification, 9.6 kbit/s to 115.2 kbit/s) e4 * Link distance: 30 cm/20 cm full 15 cone with standard or low power IrDA, respectively. Emission intensity can be set by an external resistor to increase the range for extended low power spec to > 50 cm * Typical transmission distance to standard device: 50 cm * Small package L 6.8 mm x W 2.8 mm x H 1.6 mm * Low current consumption 75 A idle at 3.6 V
* Shutdown current 10 nA typical at 25 C * Operates from 2.4 V to 3.6 V within specification over full temperature range from - 25 C to + 85 C * Split power supply, emitter can be driven by a separate power supply not loading the regulated. U.S. Pat. No. 6,157,476 * Lead (Pb)-free device * Qualified for lead (Pb)-free and Sn/Pb processing (MSL4) * Device in accordance with RoHS 2002/95/EC and WEEE 2002/96/EC
Applications
* Mobile phone * PDAs
Parts Table
Part TFBS4650-TR1 TFBS4650-TR3 TFBS4650-TR4 Description Oriented in carrier tape for side view surface mounting Oriented in carrier tape for side view surface mounting Oriented in carrier tape for side view surface mounting Qty/reel 1000 pcs 2500 pcs 6000 pcs
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Document Number 84672 Rev. 1.2, 28-May-08
TFBS4650
Vishay Semiconductors Functional Block Diagram
VCC
PD Amplifier Comparator Tri-State Driver RXD
IREDA SD TXD ASIC Mode Control IRED Driver IRED IREDC
GND
19283
Pin Description
Pin number 1 2 3 Function IREDA IREDC TXD Description IRED anode, connected via a current limiting resistor to VCC2. A separate unregulated power supply can be used. IRED cathode, do not connect for standard operation Transmitter data input. Setting this input above the threshold turns on the transmitter. This input switches the IRED with the maximum transmit pulse width of about 50 s. Receiver output. Normally high, goes low for a defined pulse duration with the rising edge of the optical input signal. Output is a CMOS tri-state driver, which swings between ground and Vcc. Receiver echoes transmitter output. Shut down. Logic low at this input enables the receiver, enables the transmitter, and un-tri-states the receiver output. It must be driven high for shutting down the transceiver. Power supply, 2.4 V to 3.6 V. This pin provides power for the receiver and transmitter drive section. Connect VCC1 via an optional filter. Ground I High I/O Active
4
RXD
O
Low
5
SD VCC GND
I
High
6 7
Pinout
TFBS4650, bottom view weight 0.05 g
19284
Document Number 84672 Rev. 1.2, 28-May-08
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TFBS4650
Vishay Semiconductors Absolute Maximum Ratings
Reference point Pin, GND unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. Parameter Supply voltage range, transceiver Supply voltage range, transmitter Voltage at RXD Input voltage range, transmitter TXD Input currents Output sinking current Power dissipation Junction temperature Ambient temperature range (operating) Storage temperature range Soldering temperature3) Repetitive pulse output current Average output current (transmitter) Virtual source size Maximum intensity for class 1 Method: (1-1/e) encircled energy IEC60825-1 or EN60825-1, edition Jan. 2001 see section Recommended Solder Profile < 90 s, ton < 20 % IIRED (RP) IIRED (DC) d Ie 0.8
1)
Test conditions 0 V < VCC2 < 6 V 0 V < VCC1 < 3.6 V All states Independent of VCC1 or VCC2 For all pins, except IRED anode pin
Symbol VCC1 VCC2 Vin Vin
Min. - 0.5 - 0.5 - 0.5 - 0.5 - 40
Typ.
Max. 6.0 6.0 VCC + 0.5 6.0 40 20
Unit V V V V mA mA mW C C C C
PD TJ Tamb Tstg - 25 - 40
250 125 + 85 + 100
500 100
mA mA mm mW/sr
(500)2)
Note: 1) Due to the internal limitation measures the device is a "class 1" device.
2) 3)
IrDA specifies the max. intensity with 500 mW/sr Sn/Pb-free soldering. The product passed VISHAY's standard convection reflow profile soldering test.
Definitions:
In the Vishay transceiver data sheets the following nomenclature is used for defining the IrDA operating modes: SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial infrared standard with the physical layer version IrPhY 1.0 MIR: 576 kbit/s to 1152 kbit/s FIR: 4 Mbit/s VFIR: 16 Mbit/s MIR and FIR were implemented with IrPhY 1.1, followed by IrPhY 1.2, adding the SIR low power standard. IrPhY 1.3 extended the low power option to MIR and FIR and VFIR was added with IrPhY 1.4. A new version of the standard in any case obsoletes the former version.
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Document Number 84672 Rev. 1.2, 28-May-08
TFBS4650
Vishay Semiconductors Electrical Characteristics Transceiver
Tamb = 25 C, VCC = 2.4 V to 3.6 V unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. Parameter Supply voltage range Dynamic supply current SD = Low (< 0.8 V), Eeamb = 0 klx, Ee < 4 mW/m2 - 25 C T + 85 C SD = Low (< 0.8 V), Eeamb = 0 klx, Ee < 4 mW/m2 T = + 25 C SD = Low, TXD = High SD = High (> VCC - 0.5 V), T = 25 C, Ee = 0 klx SD = High (> VCC - 0.5 V), - 25 C T + 85 C Test conditions Symbol VCC Min. 2.4 Typ. Max. 3.6 Unit V
Idle, dark ambient
ICC
90
130
A
Idle, dark ambient
ICC
75
A
Peak supply current during transmission Shutdown supply current dark ambient Shutdown supply current, dark ambient Operating temperature range Input voltage low (TXD, SD) Input voltage high Input voltage threshold SD Output voltage low Output voltage high RXD to VCC pull-up impedance Input capacitance (TXD, SD)
Iccpk ISD
2
3
mA
0.1
A
ISD TA VIL - 25 - 0.5 VCC - 0.5 0.9 VOL VOH RRXD CI - 0.5 VCC x 0.8 500 1.35
1.0 + 85 0.5 6.0 1.8 VCC x 0.15 VCC + 0.5
A C V V V V V k
VCC = 2.4 V to 3.6 V VCC = 2.4 V to 3.6 V VCC = 2.4 V to 3.6 V CLOAD = 15 pF VCC = 2.4 V to 3.6 V CLOAD = 15 pF SD = VCC VCC = 2.4 V to 5 V
VIH
6
pF
Document Number 84672 Rev. 1.2, 28-May-08
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TFBS4650
Vishay Semiconductors Optoelectronic Characteristics Receiver
Tamb = 25 C, VCC = 2.4 V to 3.6 V unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. Parameter Sensitivity: Minimum irradiance Ee in angular range1) 2) Maximum irradiance Ee in angular range3) No receiver output input irradiance Rise time of output signal Fall time of output signal RXD pulse width of output signal, 50%4) Receiver start up time Latency Test conditions 9.6 kbit/s to 115.2 kbit/s = 850 nm to 900 nm = 850 nm to 900 nm According to IrDA IrPHY 1.4, appendix A1, fluorescent light specification 10 % to 90 %, CL = 15 pF 90 % to 10 %, CL = 15 pF Input pulse width 1.63 s Power on delay tL Symbol Ee 5 (500) 4 (0.4) 20 20 1.7 2.0 100 50 100 100 2.9 150 200 Min. Typ. 40 (4.0) Max. 81 (8.1) Unit mW/m2 (W/cm2) kW/m2 (mW/cm2) mW/m2 (W/cm2) ns ns s s s
Ee
Ee tr (RXD) tf (RXD) tPW
Note: 1) This parameter reflects the backlight test of the IrDA physical layer specification to guarantee immunity against light from fluorescent lamps
2)
IrDA sensitivity definition: Minimum irradiance Ee in angular range, power per unit area. The receiver must meet the BER specification while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum link length
e in angular range, power per unit area. The optical delivered to the detector by a source operating at the maximum intensity in angular range at minimum link length must not cause receiver overdrive distortion and possible related link errors. If placed at the active output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER) specification. 4) RXD output is edge triggered by the rising edge of the optical input signal. The output pulse duration is independent of the input pulse duration.
3) Maximum irradiance E
For more definitions see the document "Symbols and Terminology" on the Vishay Website (http://www.vishay.com/docs/82512/82512.pdf).
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Document Number 84672 Rev. 1.2, 28-May-08
TFBS4650
Vishay Semiconductors Transmitter
Tamb = 25 C, VCC = 2.4 V to 3.6 V unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. Parameter IRED operating current, current controlled Output leakage IRED current Test conditions The IRED current is internally controlled but also can be reduced by an external resistor R1 Tamb = 85C = 0, 15, TXD = High, SD = Low, VCC1 = 3.0 V, VCC2 = 3.0 V, R1 = 30 (resulting in about 50 mA drive current) = 0, 15, TXD = High, SD = Low, VCC1 = 3.0 V, VCC2 = 3.0 V, R1 = 0 , If = 300 mA VCC1 = 5.0 V, = 0, 15 TXD = Low or SD = High (Receiver is inactive as long as SD = High) VCC = 3.0 V, If = 50 mA Symbol ID IIRED Ie Min. 200 Typ. Max. 400 1 Unit mA A
Output radiant intensity1)
4
150
mW/sr
Output radiant intensity1)
Ie
25
mW/sr
Output radiant intensity1) Saturation voltage of IRED driver Peak - emission wavelength Optical rise time, Optical fall time Optical output pulse duration Optical output pulse duration Optical overshoot
1)
Ie
0.04
mW/sr
VCEsat p tropt, tfopt 880 20
0.4 886 900 100 t 50 1.61
V nm ns s s s %
Input pulse width t < 30 s Input pulse width t 30 s Input pulse width t = 1.63 s
topt topt topt
30 1.45
300 2.2 20
Note: The radiant intensity can be adjusted by the external current limiting resistor to adapt the intensity to the desired value. The given value is for minimum current consumption. This transceiver can be adapted to > 50 cm operation by increasing the current to > 200 mA, e.g. operating the transceiver without current control resistor (i.e. R1 = 0 ) and using the internal current control.
Table 1. Truth table
Inputs SD high low low low low low TXD x high high > 50 s low low low Optical input irradiance x x x <4 > Min. irradiance Ee < Max. irradiance Ee > Max. irradiance Ee mW/m2 RXD Tri-state floating with a weak pull-up to the supply voltage low (echo on) high high low (active) x Outputs Transmitter 0 Ie 0 0 0 0
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TFBS4650
Vishay Semiconductors Recommended Circuit Diagram
Operated at a clean low impedance power supply the TFBS4650 needs only one additional external component when the IRED drive current should be minimized for minimum current consumption according the low power IrDA standard. When combined operation in IrDA and Remote Control is intended no current limiting resistor is recommended. However, depending on the entire system design and board layout, additional components may be required (see figure 1). When long wires are used for bench tests, the capacitors are mandatory for testing rise/fall time correctly. recommended to position C2 as close as possible to the transceiver power supply pins. When connecting the described circuit to the power supply, low impedance wiring should be used. In case of extended wiring the inductance of the power supply can cause dynamically a voltage drop at VCC2. Often some power supplies are not able to follow the fast current is rise time. In that case another 10 F cap at VCC2 will be helpful. Keep in mind that basic RF-design rules for circuit design should be taken into account. Especially longer signal lines should not be used without termination. See e.g. "The Art of Electronics" Paul Horowitz, Wienfield Hill, 1989, Cambridge University Press, ISBN: 0521370957.
VCC2 VCC1 GND SD TXD RXD
R1
IRED Anode IRED Cathode VCC C2 Ground SD TXD RXD
R2 C1
Table 2. Recommended Application Circuit Components
Component C1, C2 R1 R2
19286
Recommended value 0.1 F, Ceramic Vishay part# VJ 1206 Y 104 J XXMT See table 3 47 , 0.125 W (VCC1 = 3 V)
Table 3. Recommended resistor R1 ()
Figure 1. Recommended Application Circuit
The capacitor C1 is buffering the supply voltage Vcc2 and eliminates the inductance of the power supply line. This one should be a small ceramic version or other fast capacitor to guarantee the fast rise time of the IRED current. The resistor R1 is necessary for controlling the IRED drive current when the internally controlled current is too high for the application. Vishay transceivers integrate a sensitive receiver and a built-in power driver. The combination of both needs a careful circuit board layout. The use of thin, long, resistive and inductive wiring should be avoided. The inputs (TXD, SD) and the output RXD should be directly (DC) coupled to the I/O circuit. The capacitor C2 combined with the resistor R2 is the low pass filter for smoothing the supply voltage. As already stated above R2, C1 and C2 are optional and depend on the quality of the supply voltages VCCx and injected noise. An unstable power supply with dropping voltage during transmission may reduce the sensitivity (and transmission range) of the transceiver. The placement of these parts is critical. It is strongly
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VCC2 (V) 2.7 3.0 3.3
Minimized current consumption, IrDA low power compliant 24 30 36
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Document Number 84672 Rev. 1.2, 28-May-08
TFBS4650
Vishay Semiconductors Recommended Solder Profiles
Solder Profile for Sn/Pb soldering Manual Soldering Manual soldering is the standard method for lab use. However, for a production process it cannot be recommended because the risk of damage is highly dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned application note, describing manual soldering and desoldering. Storage The storage and drying processes for all VISHAY transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4. The data for the drying procedure is given on labels on the packing and also in the application note "Taping, Labeling, Storage and Packing" (http://www.vishay.com/docs/82601/82601.pdf).
260 240 220 200 180
10 s max. at 230 C 240 C max.
2...4 C/s 160 C max.
Temperature/C
160 140 120 100 80 60 40 20 0 0 50 100 150 200 250 300 350
120 s...180 s
90 s max.
2...4 C/s
Time/s
19431
Figure 2. Recommended Solder Profile for Sn/Pb Soldering
Lead (Pb)-Free, Recommended Solder Profile The TFBS4650 is a lead (Pb)-free transceiver and qualified for lead (Pb)-free processing. For lead (Pb)-free solder paste like Sn(3.0-4.0)Ag(0.5-0.9)Cu, there are two standard reflow profiles: Ramp-SoakSpike (RSS) and Ramp-To-Spike (RTS). The RampSoak-Spike profile was developed primarily for reflow ovens heated by infrared radiation. With widespread use of forced convection reflow ovens the Ramp-ToSpike profile is used increasingly. Shown below in figure 3 is VISHAY's recommended profiles for use with the TFBS4650 transceivers. For more details please refer to Application note: SMD Assembly Instruction. Wave Soldering For TFDUxxxx and TFBSxxxx transceiver devices wave soldering is not recommended.
280 260 240 220 200 180 Temperature/C 160 140 120 100 80 60 40 20 0 0
19261
T 255 C for 20 s max
T peak = 260 C max.
T 217 C for 50 s max
20 s
90 s...120 s
50 s max.
2 C...4 C/s
2 C...4 C/s
50
100
150 Time/s
200
250
300
350
Figure 3. Solder Profile, RSS Recommendation
Document Number 84672 Rev. 1.2, 28-May-08
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TFBS4650
Vishay Semiconductors Package Dimensions in mm
19322
Figure 4. TFBS4650 Mechanical Dimensions, Tolerance 0.2 mm, if not otherwise mentioned
19729
Figure 5. TFBS4650 Soldering Footprint, Tolerance 0.2 mm, if not otherwise mentioned
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Document Number 84672 Rev. 1.2, 28-May-08
TFBS4650
Vishay Semiconductors Reel Dimensions in mm
Drawing-No.: 9.800-5090.01-4 Issue: 1; 29.11.05
14017
Tape Width mm 16
A max. mm 330
N mm 50
W1 min. mm 16.4
W2 max. mm 22.4
W3 min. mm 15.9
W3 max. mm 19.4
Document Number 84672 Rev. 1.2, 28-May-08
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TFBS4650
Vishay Semiconductors Tape Dimensions for TR1 and TR3 in mm
19783
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Document Number 84672 Rev. 1.2, 28-May-08
TFBS4650
Vishay Semiconductors Tape Dimensions for TR4 in mm
20872
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Document Number 84672 Rev. 1.2, 28-May-08
TFBS4650
Vishay Semiconductors Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively. 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA. 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Document Number 84672 Rev. 1.2, 28-May-08
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Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000 Revision: 18-Jul-08
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